Microcom Incorporated

Contact us at 714-505-9806

"Building New Ideas"

Micro Com Inc Heatsinks

Fast Machine prototypes combined with low cost production manufacturing using ISO9000 facilities.


We accept drawings in pdf or SolidWorks CAD format.  We guarantee 100% build to drawing requirements for mechanical dimensions and tolerances, metal, and finish. 

Heatsink Product Capabilities



    Folded Fin

    Bonded Fin


    Mixed-mode; i.e. cast plus machine

Metal Selection

    Aluminum (6063, 6061, 380, 384)



Finish Selection



    Chem Film

    Other per request


Heatsink design requires optimization of a number of factors including the following: 

  • Surface area - It's at the surface of the heatsink where the thermal transfer takes place. Therefore, heatsinks should be designed to have a large surface; this goal can be reached by using a large amount of fine fins, or by increasing the size of the heatsink itself.
  • Airflow - Heatsinks must be designed in a way that air can easily and quickly reach all cooling fins. Especially heatsinks having a very large amount of fine fins, small distances between the fins may not allow good air flow. A compromise between high surface (many fins with small gaps between them) and good aerodynamics must be found. This also depends on the fan the heatsink is used with: A powerful fan can force air even through a heatsink with lots of fine fins with only small gaps for air flow - whereas on a passive heatsink, there should be fewer cooling fins with more space between them. Therefore, simply adding a fan to a large heatsink designed for fanless usage doesn't necessarily result in a good heatsink.
  • Thermal transfer within the heatsink - Large cooling fins are pointless if the heat can't reach them, so the heatsink must be designed to allow good thermal transfer from the heat source to the fins. Thicker fins have better thermal conductivity; so again, a compromise between high surface (many thin fins) and good thermal transfer (thicker fins) must be found. Material used has a major influence on thermal transfer within the heatsink. Sometimes, heat pipes are used to lead the heat from the heat source to the parts of the fins that are further away from the heat source.
  • Perfect flatness of the contact area - The part of the heatsink that is in contact with the heat source must be perfectly flat. A flat contact area allows you to use a thinner layer of thermal compound, which will reduce the thermal resistance between heatsink and heat source.
  • Appropriate mounting method - For good thermal transfer, the pressure between heatsink and heat source must be high. Heatsink clips must be designed to provide a strong pressure, while still being reasonably easy to install. Heatsink mountings with screws/springs are often better than regular clips. Thermoconductive glue or sticky tape should only be used in situations where mounting with clips or screws isn't possible.
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